TITI is making great strides forward in the race to create efficient cooling systems as the era of high performance computing kicks into gear. With demand for faster processors, smaller form-factor chassis, and lower silicon operating temperatures growing rapidly, we have put an emphasis on concurrent design of CPU's cooling systems.

At Computex this year, TITI announced its vapor chamber application. This innovative prototype successfully utilizes TITI's "Super Medium" to transfer heat from the CPU die to a remote position with better ventilation. 

TITI proudly launch new products with vapor chamber solution at Q3 2002.

Please see the following document for a brief description of TITI Twin Cooler.