Compact cooling devices are poised to deal with the next generation of ever-hotter CPUs.

High-performance thermal alternatives are so urgent under development to handle the incredibly high heat loads of future CPUs that will blow all the metal thermal solutions nowadays. T.I.T.I. has been advancing our thermosyphon skills called vapor chamber applications to fulfil the upcoming high Watt CPUs and its arrogant demand of thermal resistance.

With demand for faster processors, smaller form-factor chassis, and lower silicon operating temperatures growing rapidly, we have put an emphasis on concurrent design of CPU's cooling systems.

This innovative solution (as shown right) successfully utilizes TITI's "Super Medium" to transfer heat from the CPU die to a remote position with better ventilation.

Please see the document for a brief description of TITI Twin Cooler.